{"id":151456,"date":"2024-04-05T02:46:01","date_gmt":"2024-04-05T02:46:01","guid":{"rendered":"https:\/\/dailytalks.org\/?p=151456"},"modified":"2024-04-05T02:46:01","modified_gmt":"2024-04-05T02:46:01","slug":"tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofusetm-preforms","status":"publish","type":"post","link":"https:\/\/dailytalks.org\/?p=151456","title":{"rendered":"TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE(TM) Preforms"},"content":{"rendered":"<p>TOKYO, Mar 11, 2024 &#8211; (JCN Newswire) &#8211;\u00a0TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced today that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE\u2122 low-temperature fired paste for gold-to-gold bonding.AuRoFUSE\u2122 is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low temperatures&#8230;<br \/><a href=\"https:\/\/www.jcnnewswire.com\/pressrelease\/89425\/3\/\" class=\"button purchase\" rel=\"nofollow noopener\" target=\"_blank\">Read More<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>TOKYO, Mar 11, 2024 &#8211; (JCN Newswire) &#8211;\u00a0TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo;<\/p>\n","protected":false},"author":1,"featured_media":151457,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[35],"tags":[],"class_list":["post-151456","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech"],"featured_image_urls":{"full":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"thumbnail":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b-150x57.",150,57,true],"medium":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"medium_large":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"large":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"1536x1536":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"2048x2048":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"chromenews-featured":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"chromenews-large":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false],"chromenews-medium":["https:\/\/dailytalks.org\/wp-content\/uploads\/2024\/04\/151456-tanaka-establishes-bonding-technology-for-high-density-semiconductor-mounting-using-aurofu660f65f3d1b3b",240,57,false]},"author_info":{"display_name":"Jonathan Jeriah","author_link":"https:\/\/dailytalks.org\/?author=1"},"category_info":"<a href=\"https:\/\/dailytalks.org\/?cat=35\" rel=\"category\">Tech<\/a>","tag_info":"Tech","comment_count":"0","_links":{"self":[{"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/posts\/151456","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/dailytalks.org\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=151456"}],"version-history":[{"count":0,"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/posts\/151456\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/dailytalks.org\/index.php?rest_route=\/wp\/v2\/media\/151457"}],"wp:attachment":[{"href":"https:\/\/dailytalks.org\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=151456"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/dailytalks.org\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=151456"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/dailytalks.org\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=151456"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}